Introducing our newly shipped PCB, which is made of Rogers RT/duroid 6010.2LM, a high-performance substrate. With its exceptional features and reliable construction, this PCB is engineered to meet the demands of various applications. Let's explore the key specifications and benefits that make this PCB an outstanding choice for electronic projects.
PCB Substrates: Unmatched Performance and Reliability
The Rogers RT/duroid 6010.2LM features advanced ceramic-PTFE composites, ensuring superior performance and reliability. With a dielectric constant (DK) of 10.2 +/- 0.25 at 10 GHz/23°C, this substrate offers high electrical efficiency, enabling circuit size reduction without compromising performance. The low dissipation factor of 0.0023 at 10 GHz/23°C guarantees minimal signal loss, making it ideal for applications operating at X-band frequencies or below.
| Dielectric Constant,εProcess | 10.2±0.25 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped stripline |
| Dielectric Constant,εDesign | 10.7 | Z | | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor,tanδ | 0.0023 | Z | | 10 GHz/A | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | -425 | Z | ppm/℃ | -50℃-170℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 5 x 105 | | Mohm.cm | A | IPC 2.5.17.1 |
| Surface Resistivity | 5 x 106 | | Mohm | A | IPC 2.5.17.1 |
| Tensile Properties | ASTM D638 (0.1/min. strain rate) |
| Young's Modulus | 931(135) 559(81) | X Y | MPa(kpsi) | A |
| Ultimate Stress | 17(2.4) 13(1.9) | X Y | MPa(kpsi) | A |
| Ultimate Strain | 9 to 15 7 to 14 | X Y | % | A |
| Compressive Properties | | ASTM D695 (0.05/min. strain rate) |
| Young's Modulus | 2144 (311) | Z | MPa(kpsi) | A |
| Ultimate Stress | 47(6.9) | Z | MPa(kpsi) | A |
| Ultimate Strain | 25 | Z | % | |
| Flexural Modulus | 4364 (633) 3751 (544) | X | MPa(kpsi) | A | ASTM D790 |
| Ultimate Stress | 36 (5.2) 32 (4.4) | X Y | MPa(kpsi) | A |
| Deformation under load | 0.26 1.3 | Z Z | % | 24hr/50℃/7MPa 24hr/150℃/7MPa | ASTM D261 |
| Moisture Absorption | 0.01 | | % | D48/50℃ 0.050"(1.27mm) thick | IPC-TM-650 2.6.2.1 |
| Thermal Conductivity | 0.86 | | W/m/k | 80℃ | ASTM C518 |
| Coefficient of Thermal Expansion | 24
24
47 | X
Y
Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |
| Td | 500 | | ℃ TGA | | ASTM D3850 |
| Density | 3.1 | | g/cm3 | | ASTM D792 |
| Specific Heat | 1.00(0.239) | | j/g/k
(BTU/ib/OF) | | Calculated |
| Copper Peel | 12.3 (2.1) | | pli (N/mm) | after solder float | IPC-TM-650 2.4.8 |
| Flammability | V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
Exceptional Thermal and Environmental Stability
With a Td (decomposition temperature) exceeding 500°C according to TGA testing, the RT/duroid 6010.2LM provides outstanding thermal stability, ensuring reliable operation even under demanding conditions. Its moisture absorption rate of only 0.01% guarantees consistent electrical performance, even in humid environments. The coefficient of thermal expansion (CTE) values of 24 ppm/°C (X-axis), 24 ppm/°C (Y-axis), and 47 ppm/°C (Z-axis) enable dimensional stability and compatibility with other components.
Features for Optimal Performance and Versatility
The RT/duroid 6010.2LM offers several features designed to enhance performance and versatility. Its tight εr and thickness control ensure repeatable circuit performance, allowing for consistent and reliable results. The substrate is clad with standard and reverse treated electrodeposited copper foil, guaranteeing excellent conductivity and signal integrity. The reliable plated through-holes in multi-layer boards enable seamless connections and efficient signal transfer.
| PCB Material: | Ceramic-PTFE composite |
| Designator: | RT/duroid 6010LM |
| Dielectric constant: | 10.2 ±0.25 (process); 10.7 (design) |
| Layer count: | 1 Layer, 2 Layer |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Dielectric thickness: | 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.90mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, OSP. |
Precise Construction Details for Specifications
This 2-layer rigid PCB construction comprises copper layers with a thickness of 35 μm, sandwiching the 0.635 mm (25mil) RT/duroid 6010.2LM core. The finished board dimensions of 34 mm x 18 mm provide a compact form factor, with a tolerance of +/- 0.15mm for precise manufacturing. With a minimum trace/space of 14/10 mils and a minimum hole size of 0.25mm, this PCB accommodates intricate circuit designs. The finished board thickness of 0.8mm, 1oz (1.4 mils) outer layer copper weight, and 20 μm via plating thickness ensure robust construction and reliable performance.
Additional Specifications and Applications
This PCB boasts immersion gold surface finish, blue top solder mask, and white top silkscreen, providing a professional and visually appealing appearance. With 50-ohm impedance control on 14mil/10mil track/spacing, this PCB is optimized for high-frequency applications. It undergoes 100% electrical testing before shipment, ensuring the highest quality standards.
With worldwide availability, the RT/duroid 6010.2LM caters to a wide range of industries and applications. Whether you're designing patch antennas, satellite communication systems, power amplifiers, aircraft collision avoidance systems, or ground radar warning systems, this PCB empowers your projects with exceptional performance and reliability.
Contact our dedicated sales team at sales10@bichengpcb.com for any technical inquiries or to explore the possibilities of the RT/duroid 6010.2LM in your applications. Experience the power of high-performance PCBs with Rogers RT/duroid 6010.2LM and take your designs to new heights of success.
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High Frequency PCB Built On 25mil RT Duroid 6010.2LM With Immersion Gold Images
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